Advanced 3D Process Integration and Analytics Modeling Engineer
Location: Hyderabad, AP, IN
Company: Micron
Responsibilities include but are not limited to:
- Development of 3D models through process flows for DRAM, NAND, and EM technologies
- Estimate impact of individual process/structure variations on the completed chip structure
- Perform margin analysis, variation studies, and identify failure modes
- Build 3D models for scaling studies
- Perform mesh generation, structure conversions, software development, large-scale 3D structure generation and visualization, and parallel programming
- Design and develop machine learning tools toward a common platform
- Define, design, and implement analytic applications that extracts data and images as inputs from relational databases and various data sources to build predictive statistical models
- Work with process engineers and database developers to implement comprehensive database solutions
- Work with engineers from TCAD, process integration, process development, as well as program manager and computational engineers to drive accelerated technology development
- Develop stress/strain models that captures thermally-induced deformation and failures in complex 3D structures
- Development of advanced numerical methods, meshing algorithms, multi-scale modeling and coupling schemes, and stand-alone applications
- Expert use of hierarchical high-dimensional stress modeling
Qualifications:
- 3+ years of industry experience in the use of process integration modeling tools
- 3+ years of experience in statistical and machine learning techniques
- 3+ years of experience in multi-scale modeling and simulations
- 3+ years of experience with stress/strain modeling
- Experience with application development is strongly desired
- Strong background in semiconductor processes and integration
- Strong background in data science techniques, relational databases, machine learning algorithms, and image processing
- Background in Python, Hadoop, Java, and SQL
- Strong knowledge of solid mechanics
- Excellent verbal and written communication skills with the ability to operate independently across large teams in a fast-paced dynamic environment
Education: A M.S. or PhD in Electrical Engineering, Computer Science, Chemical Engineering, Mechanical Engineering, Materials Science, Physics, or related discipline.